We are now expanding the product groups, having started mass production in 2016.
We aim to maintain our position as the Global Top Tier CMP Slurry Supplier based on our sheer technological prowess.
|SW-300||Low defect slurry used in adjustment of semiconductor wiring process and surface roughness|
|NTS-300||Possible to selectively polish the silicon nitride film (~1,000 A/min) and stop at the poly-silicon and silicon oxide films|
|SWC-100||A colloidal ceria-based next-generation product with a low scratch, low dishing function|
|SAC-100||The new work process uses amorphous carbon membrane, a next-generation material, to achieve a high polishing rate and low defect performance.|
|HTC-L-200||Free adjustment of the polishing rate of Silicon Oxide, Copper, Silicon Nitride, products used in the TSV work process, according to customer requirements.|