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Pad/Sluury 김종우 PL 031-240-0481 jongwoo15@sk.com
Pad/Sluury 권영필 매니저 yp.kwon@sk.com
Pad/Sluury 권민균 매니저 mingyun@sk.com

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HOME Semiconductor CMP Slurry

CMP Slurry

This represents an important jump forward based on our superb research infrastructure.

We are now expanding the product groups, having started mass production in 2016. 

We aim to maintain our position as the Global Top Tier CMP Slurry Supplier based on our sheer technological prowess.​

Cases of application

02.jpg CMP process

Usage

Wide planarization of semiconductor wafers
Adjustment of topology and surface roughness

Major products

Major products
Major products Features
SW-300 Low defect slurry used in adjustment of semiconductor wiring process and surface roughness
NTS-300 Possible to selectively polish the silicon nitride film (~1,000 A/min) and stop at the poly-silicon and silicon oxide films
SWC-100 A colloidal ceria-based next-generation product with a low scratch, low dishing function
SAC-100 The new work process uses amorphous carbon membrane, a next-generation material, to achieve a high polishing rate and low defect performance.
HTC-L-200 Free adjustment of the polishing rate of Silicon Oxide, Copper, Silicon Nitride, products used in the TSV work process, according to customer requirements.

Certification

ISO