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Item Name Tel E-mail
Pad/Slurry 김종우 PL 031-240-0481 jongwoo15@sk.com
Pad/Slurry 권영필 매니저 yp.kwon@sk.com
Pad/Slurry 권민균 매니저 mingyun@sk.com

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HOME Semiconductor CMP Pad

CMP Pad

Pad products used to enhance the level of integration of semiconductors

The CMP (Chemical Mechanical Polishing) Pad is designed to increase the integration of semiconductors by polishing the surface of semiconductor wafers physically and chemically. It is a consumable for which demand is growing due to the rapid increase in the production of 3D Nand Flash and such like.


Cases of application

20200812191913185018.png CMP Pad
01.jpg CMP process

Usage

Polishing the surface of semiconductor wafers

Major products

Major products
Major products Features
HD-319B General purpose hard type of CMP Pad
HD-500C Defect/scratch reducing hard type of CMP Pad
SD-138B Defect/scratch reducing semi-hard type of CMP Pad
HD-300D Hard-type CMP Pad for 200 mm wafers
Other Dressing Pad for diamond disk quality inspection

Packing unit

Vacuum packing of each sheet → Delivery to customer businesses after packing

Table of physical properties of major products

Table of physical properties for major products, Composed of  B-STN, E-HEN, S-HSN, T-THx
​Items​ ​Unit​ HD-319B HD-500C SD-138B HD-300D
Density g/cm3 0.8 0.75 0.8 0.8
Hardness Shore D 59 54 42 59
Diameter mm 762/742 762/742 762/742 508
Groove Pattern Circle Circle Circle Circle

* Diameters and groove dimensions can be adjusted at the customer’s request.