SKC’s glass substrate is a revolutionary form factor widely expected to be a game changer in the semiconductor packaging domain. It meets the requirements for ultra-fine-pitch semiconductor packaging due to its smooth surface and excellent processibility into larger square panels. Additionally, SKC’s glass substrate eliminates the need for the interposer, allowing the substrate thickness to be reduced by 25% while power consumption is reduced by over 30% compared to other materials used in the packaging domain.​