Cases of application

Usage

Major products

Major products	Features
SW-300	Low defect slurry used in adjustment of semiconductor wiring process and surface roughness
NTS-300	Possible to selectively polish the silicon nitride film (~1,000 A/min) and stop at the poly-silicon and silicon oxide films
SWC-100	A colloidal ceria-based next-generation product with a low scratch, low dishing function
SAC-100	The new work process uses amorphous carbon membrane, a next-generation material, to achieve a high polishing rate and low defect performance.
HTC-L-200	Free adjustment of the polishing rate of Silicon Oxide, Copper, Silicon Nitride, products used in the TSV work process, according to customer requirements.

Certification