메뉴 바로가기 본문 바로가기(skip to content)

contact

Item Name Tel E-mail
CMP Pad Jong Woo, Kim 82-2-3787-1010 jongwoo15@sk.com
CMP Slurry Ken Yoon 82-2-3787-1848 ken.yoon@sk.com

Download

Electronic Material Business

HOME Electronic Material Business CMP Pad

CMP Pad

Pad Product enhancing Semiconductor Integration

CMP Pad (Chemical Mechanical Polishing Pad) is a product which increases semiconductor integration by smoothening the semiconductor wafer surface through physical and chemical polishing processes. It is an expendable material that is facing a high demand due to a spike in 3D NAND flash production.


Applied Cases

skc_02_creation_04_전자재료사업_02_CMP패드_1.png Semiconductor Wafer
skc_02_creation_04_전자재료사업_02_CMP패드_2_영문.jpg
skc_02_creation_04_전자재료사업_02_CMP패드_3.png CMP Pad

Use

For the polishing of semiconductor wafer surface

Packing unit

Vacuum packaging by wafer → Delivery after packaging

Technical Information